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IA NT Features Applications Very low profile Very fast tripping time High voltage RoHS compliant* Symmetrical 2018 footprint Agency recognition: Power Over Ethernet (IEEE 802.3 af) port protection Automotive electronic control module protection Telecom equipment low voltage protection *R oH S CO M PL T V Rheinland MF-SMDF Series - PTC Resettable Fuses Electrical Characteristics Tripped Power Dissipation Ihold Model V max. Volts I max. Amps Itrip Resistance Ohms at 23 C RMin. R1Max. Max. Time To Trip Amperes at 23 C Seconds at 23 C Amperes at 23 C Hold Trip Watts at 23 C Typ. MF-SMDF050 MF-SMDF100* MF-SMDF150* MF-SMDF200 *Agency approval pending. 60 15 15 10 10 40 40 40 0.55 1.1 1.5 2.0 1.20 2.20 3.00 4.00 0.200 0.06 0.05 0.03 1.0 0.36 0.17 0.100 2.5 8.0 8.0 8.0 3.0 0.4 0.8 2.40 0.9 1.0 1.1 1.1 Environmental Characteristics Operating Temperature ......................................-40 C to +85 C Maximum Device Surface Temperature in Tripped State ................................................125 C Passive Aging......................................................+85 C, 1000 hours ....................................5 % typical resistance change Humidity Aging....................................................+85 C, 85 % R.H. 1000 hours ..................5 % typical resistance change Thermal Shock ....................................................+85 C to -40 C, 20 times ........................10 % typical resistance change Solvent Resistance ............................................MIL-STD-202, Method 215 ........................No change Vibration ..............................................................MIL-STD-883C, Method 2007.1, ................No change Condition A Test Procedures And Requirements For Model MF-SMDF Series Test Test Conditions Accept/Reject Criteria Visual/Mech.....................................Verify dimensions and materials ....................................Per MF physical description Resistance ......................................In still air @ 23 C............................................................Rmin R R1max Time to Trip ....................................At specified current, Vmax, 23 C ..................................T max. time to trip (seconds) Hold Current ..................................30 min. at Ihold ..............................................................No trip Trip Cycle Life ................................Vmax, Imax, 100 cycles ..................................................No arcing or burning Trip Endurance ................................Vmax, 48 hours ..............................................................No arcing or burning Solderability ....................................ANSI/J-STD-002 ............................................................95 % min. coverage UL File Number ..................................E174545 http://www.ul.com/ Follow link to Certifications, then UL File No., enter E174545 CSA File Number ..............................CA110338 http://directories.csa-international.org/ Under "Certification Record" and "File Number" enter 110338-0-000 TUV Certificate Number ....................R 02057213 http://www.tuvdotcom.com/ Follow link to "other certificates", enter File No. 2057213 Thermal Derating Chart - Ihold / Itrip (Amps) Ambient Operating Temperature Model MF-SMDF050 MF-SMDF100 MF-SMDF150 MF-SMDF200 -40 C 0.87 / 1.90 1.71 / 3.42 2.38 / 4.76 2.95 / 5.90 -20 C 0.77 / 1.68 1.52 / 3.04 2.10 / 4.20 2.65 / 5.30 0 C 0.67 / 1.46 1.32 / 2.64 1.82 / 3.64 2.35 / 4.70 23 C 0.55 / 1.20 1.10 / 2.20 1.50 / 3.00 2.00 / 4.00 40 C 0.46 / 1.00 0.94 / 1.88 1.27 / 2.54 1.74 / 3.48 50 C 0.41 / 0.89 0.84 / 1.68 1.13 / 2.26 1.59 / 3.18 60 C 0.36 / 0.79 0.74 / 1.48 0.99 / 1.98 1.44 / 2.88 70 C 0.31 / 0.68 0.64 / 1.28 0.85 / 1.70 1.29 / 2.58 85 C 0.23 / 0.50 0.50 / 1.00 0.64 / 1.28 1.06 / 2.12 *RoHS Directive 2002/95/EC Jan 27 2003 including Annex Specifications are subject to change without notice. Customers should verify actual device performance in their specific applications. MF-SMDF Series - PTC Resettable Fuses Product Dimensions Model MF-SMDF050 MF-SMDF100 MF-SMDF150 MF-SMDF200 Packaging: 3000 pcs. per reel. Top and Bottom View A Side View C Recommended Pad Layout 1.5 0.05 (.059 .002) 1.5 0.05 (.059 .002) 4.6 0.1 (.181 .004) 3.4 0.1 (.134 .004) D A Min. 4.72 (0.186) 4.72 (0.186) 4.72 (0.186) 4.72 (0.186) Max. 5.44 (0.214) 5.44 (0.214) 5.44 (0.214) 5.44 (0.214) Min. 4.22 (0.166) 4.22 (0.166) 4.22 (0.166) 4.22 (0.166) B Max. 4.93 (0.194) 4.93 (0.194) 4.93 (0.194) 4.93 (0.194) Min. 0.79 (0.031) 0.55 (0.022) 0.55 (0.022) 0.55 (0.022) C Max. 1.09 (0.043) 0.85 (0.033) 0.85 (0.033) 0.85 (0.033) D Min. 0.30 (0.012) 0.30 (0.012) 0.30 (0.012) 0.30 (0.012) UNIT = MM (INCHES) Terminal material: Electroless Ni under immersion Au Termination pad solderability: Standard Au finish: Meets ANSI/J-STD-002 Category 2. Recommended Storage: 40 C max./70 % RH max. B Typical Time to Trip at 23 C 100 MF-SMDF050 10 Time to Trip (Seconds) 1 The Time to Trip curves represent typical performance of a device in a simulated application environment. Actual performance in specific customer applications may differ from these values due to the influence of other variables. MF-SMDF200 0.1 0.01 MF-SMDF100 MF-SMDF150 0.001 0.1 1 10 100 Fault Current (Amps) Specifications are subject to change without notice. Customers should verify actual device performance in their specific applications. MF-SMDF Series - PTC Resettable Fuses Solder Reflow Recommendations Preheating Soldering Cooling How to Order MF - SMDF 050 - 2 Multifuse(R) Product Designator Series SMDF = 2018 Surface Mount Component Hold Current, Ihold 050, 100, 150, 200 (0.50 - 2.00 Amps) Packaging Packaged per EIA 481-1 -2 = Tape and Reel 300 250 Temperature (C) 200 150 100 50 0 Typical Part Marking Represents total content. Layout may vary. 160-220 10-20 Time (seconds) 120 BI-WEEKLY DATE CODE: WEEKS 49-50 = Y Notes: * MF-SMDF models cannot be wave soldered. Please contact Bourns for hand soldering recommendations. * If reflow temperatures exceed the recommended profile, devices may not meet the performance requirements. * Compatible with Pb and Pb-free solder reflow profiles. 505Y YEAR CODE: 5 = 2005 PART IDENTIFICATION: 50 = MF-SMDF050 10 = MF-SMDF100 15 = MF-SMDF150 20 = MF-SMDF200 MF-SMDF SERIES, REV. J, 05/06 Specifications are subject to change without notice. Customers should verify actual device performance in their specific applications. MF-SMDF Series Tape and Reel Specifications MF-SMDF Series per EIA 481-2 16.0 0.3 (0.630 0.012) 4.0 0.1 (0.157 0.004) 8.0 0.1 (0.315 0.004) 2.0 0.1 (0.079 0.004) 5.1 0.15 (0.201 0.006) 5.6 0.23 (0.220 0.009) 12.1 (0.476) 1.5 + 0.1/-0.0 (0.059 + 0.004/-0) 7.5 0.10 (0.295 0.004) 1.75 0.10 (0.069 0.004) 14.25 (0.561) 0.6 (0.024) 0.1 (0.004) 1.0 0.15 (0.039 0.015) 390 (15.35) 160 (6.30) Tape Dimensions W P0 P1 P2 A0 B0 B1 max. D0 F E1 E2 min. T max. T1 max. K0 Leader min. Trailer min. Reel Dimensions A max. N min. W1 W2 max. MM (INCHES) 331 (13.03) 50 (1.97) 16.4 + 2.0/ -0.0 (0.646 + 0.079/-0.0) 22.4 (0.882) P0 T D0 P2 E1 UNIT = W2(MEASURED AT HUB) COVER TAPE F B1 B0 K0 T1 P1 A0 W1(MEASURED AT HUB) E2 W A N(HUB DIA.) Specifications are subject to change without notice. Customers should verify actual device performance in their specific applications. |
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